1-PAS
Card to Bundle in One Pass
World’s first inline solution for high volume personalization, affixing, packaging and pack-out of secure open and closed loop cards at 20,000 PPH.
CEG-1
Cold Glue System
Revolutionize your production with the CEG-1 Cold Glue System, engineered for high-precision, tamper-proof adhesive applications.
Advanced Cold Gluing Technology for Secure Applications
The CEG-1 Cold Glue System is specifically engineered for secure, tamper-proof sealing applications, offering precision and efficiency in dispensing cold extruded glue.
This system is distinguished by its capability to handle up to eight glue heads simultaneously, delivering dot, bead, or continuous glue patterns across a wide range of materials, including PVC, card stock, corrugated cardboard, plastic film, and metals.
It’s designed to integrate seamlessly with various production lines, particularly where permanent sealing is crucial.
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Membership & Loyalty
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eCommerce
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Retail
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Pharmaceuticals
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Luxury Goods
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POP Displays
Design Variations
The CEG-1 is uniquely designed to accommodate various production scales without the need for different models, emphasizing its flexibility and adaptability to multiple operational setups.
Where Used
This technology is used in the following automated solutions.
SC-500
Secure Card Packaging
Inline card to carrier affixing, booklet tipping, 4-corner secure folding/gluing, and DOD personalization.
FG-800
Reinforced Carton Specialty Finishing
Combine folding, gluing, affixing, personalization, and sorting in a single pass.
Technology
in Action
Dispensing
- Up to 8 glue heads for simultaneous application
- Modular design allows for easy customization and expansion
- Integrated manual pushbutton for instant manual control
Precision
- High switching frequency ensures rapid response times
- Precise stroke adjustment for fine control of adhesive quantity
- Clean cut-off with optimized nozzle geometry to minimize waste
Durability
- Designed for 1 billion operating cycles ensuring longevity
- Easy maintenance with accessible components
- Robust construction suitable for demanding industrial environments
Integration
- Compact design facilitates integration into existing lines
- Compatible with various Pack-Smart systems like the PF900 and HEG 1
- Supports both small and large-scale operations
Operational Capacity
- Speed: Capable of up to 400 m/min
- Max Pressure: 30 bar for consistent glue application
System Specifications
- Tank Size: 20 L, reducing refill frequency
- Viscosity Handling: Up to 4000 cps for a wide range of adhesives
Design Specifications
- Minimal design footprint with a width of just 20 mm
- LED displays for real-time feedback and system monitoring
Sustainability
- IP54 rating, ensuring protection against dust and moisture
- Designed to operate within a temperature range of 15 to 30°C
Optional Features
Related modules are available for inline applications.
HM-10
Hot Melt Glue System
Revolutionize your production with the HM-10 Hot Melt Glue System, offering precision application for a wide range of adhesive needs.
BF-100
Back Fold Module
An ultra-lightweight alloy folding attachment. The BF-100 delivers unmatched productivity for four and six-corner folding tasks.
MFF-120
Front Fold Module
Streamline your production with the MFF-120 Front Fold Module, designed for high-speed, precise folding of various products at right angles.
PF50-90
Plow Fold Module
The PF50-90 Plow Fold Module integrates seamlessly into production lines, offering both left and right folding configurations.
