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World’s first inline solution for high volume personalization, affixing, packaging and pack-out of secure open and closed loop cards at 20,000 PPH.
Designed for both fugitive and permanent bonding, this hot melt glue system offers unparalleled accuracy with up to 8 heads.
This technology is meticulously engineered to dispense hot extruded glue with exceptional control and precision. Whether you require a permanent bond or a temporary hold, the Hot Melt Glue system is equipped with versatile heads capable of creating dots, beads, or continuous patterns across a diverse range of materials. Its modular design seamlessly integrates into existing production lines or stands alone as a robust solution for all your gluing needs.
With its advanced temperature control, the Hot Melt Glue system ensures stable viscosity, providing a protective seal and tamper-evident security for a variety of packaging applications. The system’s four applicator heads are designed to minimize spillage, maximizing efficiency and safeguarding against waste. Embrace the benefits of a low-maintenance, energy-efficient hot gluing system with Pack-Smart’s HM Series.
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The HM-10 Hot Melt Glue system is available in various configurations, including options with 4 to 8 heads, to accommodate different production scales and application complexities.
This technology is used in the following automated systems.
World’s first inline solution for high volume personalization, affixing, packaging and pack-out of secure open and closed loop cards at 20,000 PPH.
Inline card to carrier affixing, booklet tipping, 4-corner secure folding/gluing, and DOD personalization.
Related modules are available for inline applications.
The CEG-1 Cold Glue System is engineered for high-precision, tamper-proof adhesive applications.
Elevate your production capabilities with the PG-900 Flexo Pattern Glue Module, designed for precise and flexible adhesive applications.