1-PAS
Card to Bundle in One Pass
World’s first inline solution for high volume personalization, affixing, packaging and pack-out of secure open and closed loop cards at 20,000 PPH.
CB-750
Continuous Motion
Blister Seal
Elevate your packaging efficiency with the CB-7500 Continuous Motion Blister Seal module, designed for high-speed, precise sealing of blister packs.
High-Speed Continuous Motion Blister Seal for Maximum Efficiency
The CB-750 Continuous Motion Blister Seal module is a cutting-edge solution designed to optimize high-speed packaging processes.
Capable of processing between 6,000 to 9,600 carriers per hour, this module leverages advanced servo control and heat sealing technology to ensure precise and secure packaging.
Ideal for industries requiring rapid and reliable blister sealing, the CB-750 enhances productivity and maintains stringent quality standards.
Multipack Open Loop
eCommerce
Where this technology is used
This technology is used in the following automated systems.
CP-250
Card Personalization System
With speeds up to 30,000 PPH, it is ideal for all your closed, secure, and open loop needs.
SC-500
Secure Card Packaging
Inline card to carrier affixing, booklet tipping, 4-corner secure folding/gluing, and DOD personalization.
EMV-250
Smart Card Issuance
Engineered to meet the rigorous demands of EMV chip card encoding, this system combines advanced encoding capabilities with high-speed processing to deliver unparalleled efficiency.
Technology
in Action
Drive & Motion Control
- 10 HP Servo drive for high performance.
- 15-station continuous pocket systems for efficient processing.
- Precision linear guides dual rail track for stability and accuracy.
Product Handling
- 15 top and bottom molds for versatile Multipack sealing.
- Product bridging module for seamless product flow.
- Jam detection and upper compression module to prevent disruptions.
Design & Usability
- 10″ Colour operator interface with recipe handling for up to 1000 products.
- Guarding and USB connection for safety and ease of use.
- Fibre optic sensors with digital displays for precise monitoring.
Automation & Control
- 100% Digital brushless servo drives with common bus for efficient control.
- “First in First out” product tracking for accurate processing.
- Virtual machine platform for machine diagnostics and system expandability to 45 servo axes.
Technical Details
- Speed: Up to 150 m/min
- Product Size: Width 89—508 mm, length 75—457 mm
- Stock weight: 145 gsm to 0.86 mm thick
Operational
- Power Requirements: 208—240 V AC, 3-phase
- Motor Size: 3 kW, 6 HP
- Air Consumption: Specifics depend on the setup
Optional Technologies
Related modules are available for inline applications.
CEG-1
Cold Glue System
The CEG-1 Cold Glue System is engineered for high-precision, tamper-proof adhesive applications.
HM-10
Hot Melt Glue System
Revolutionize your production with the HM-10 Hot Melt Glue System, offering precision application for a wide range of adhesive needs.
