Card to Bundle in One Pass
World’s first inline solution for high volume personalization, affixing, packaging and pack-out of secure open and closed loop cards at 20,000 PPH.
Revolutionize material adhesion with Pack-Smart’s SP Series, employing advanced plasma technology to enhance bonding for inks, adhesives, and coatings on diverse substrates.
Pack-Smart’s SP Series utilizes cutting-edge plasma technology to optimize surface properties for improved adhesion.
By emitting highly energized plasma, the SP Series effectively cleans and activates surface areas, enabling better bonding of inks, adhesives, and coatings.
This technology is crucial for industries where durable and reliable adhesion is essential, including packaging, printing, and automotive manufacturing.
Membership & Loyalty
Open Loops Cards
Closed Loop Cards
SP-10
SP-50
This technology is used in the following automated solutions.
World’s first inline solution for high volume personalization, affixing, packaging and pack-out of secure open and closed loop cards at 20,000 PPH.
With speeds up to 30,000 PPH, it is ideal for all your closed, secure, and open loop needs.
Inline card to carrier affixing, booklet tipping, 4-corner secure folding/gluing, and DOD personalization.
Related modules are available for inline applications.
The UVL-7550 integrates high-power LED UV lamps for superior, high-speed, single-pass drying and curing applications. Offering an eco-friendly solution with significantly reduced power consumption compared to traditional systems.
A user-friendly, fully packaged CCD reader, offering easy integration and several configurations to meet a variety of needs.
The BSG-1000 Barcode Scanning and Grading module is designed to ensure that all your barcoded products meet ISO standards for quality.